Innovative products and services

Main characteristics:

• microprocessor furnace of chamber type (not conveyor) of convection heating and solder melting is designed for soldering printed components of electronic equipment using soldering pastes in conditions of small-scale and single production and in the manufacture of prototypes;
• uniform, gentle heating of printed circuit boards on both sides, eliminating the appearance of shadow effects because of the convection method of heat transfer;
• control of process parameters by the built-in microprocessor, the output of information to the LCD in text and graphic form;
• storage in memory of 5 typical soldering modes and up to 255 user-debugged programs of technological modes (profiles), their quick change by the operator;
• built-in self-diagnosis system and unauthorized access protection system, which excludes accidental or intentional change of soldering modes;
• the ability to visually monitor the progress of the technological process and make adjustments to the soldering mode;
• automatic cooling of the printing unit to the set temperature after working off the thermal profile;
• the maximum size of the loaded board is at least 305×305 mm;
• maximum loading height — at least 45 mm;
• accuracy of temperature maintenance — ± 3 ° C;
• the presence of a soldering system in an inert environment.